SO2-12-F Heated-air Circulating Type Clean Oven for 300-mm Wafers
This clean oven processes 300-mm (12-inch) wafers for semiconductor production.
With FOUPs, 50 wafers can be fully automatically processed for each chamber. The system can be used for low-temperature processing of polyimide and other materials.
- Fully automatic clean oven for FOUP operation
- Max 50 wafers per chamber
- One robot is available for 2 chambers
- 2 FOUPs per chamber
- High speed wafer transfer by double wafer handling robot
This clean oven for semiconductor production was developed by introducing the best-selling FPD manufacturing equipment, single wafer processing clean oven. This oven can run fully automatically using 300-mm (12-inch) FOUPs. 50 wafers can be processed for each chamber and up to 2 chambers can be installed (2 FOUPs are used for each chamber). High throughput in a short cycle time is realized in low-temperature processing of polyimide and other materials.
|Outer dimension||W3000×D3105×H2200 mm
(2 chamber type)
|Heating method||Heated-air circulating|
|Operation temperature||70 to 450°C|
|Flat zone length||500mm|
|Batch size||50 wafers|
|I/O port||2 or 4|
|HOST communication||HSMS/GEM300 (Option)|
Convertible 8 inch
Related Solution Cases
[case-005] Warp Reduction Annealing
Achieving an optimal warp reduction annealing process by employing expertise and analytic technology
[case-015] Large Batch Type Clean Oven System
Double the number of batches to improve productivity