VF-5300H Vertical Furnace for Gate Insulating Film Formation
A vertical furnace enabling high-temperature processing, ideal for power device manufacturing. Supports oxynitriding and wafers of up to 8 inches in size. Features an automatic wafer transfer mechanism, and can be used for mass production.
Features
- Supports max. 100 wafers (200mm / 8-inch,
150mm / 6-inch), and use on mass-production lines. - Supports a wide range of wafer sizes up to 8 inches.
- Enables temperature monitoring in wafer vicinity.
- The furnace interior features our proprietary metal-free construction.
- Supports serial processing of different oxidizing/oxynitriding processes (wet/dry oxidizing, H2 annealing, NH3 nitriding, NO/N2O oxynitriding).
- Chamber cleaning mechanism (option)
Overview
VF-5300H is a vertical furnace that can process a maximum of 100 wafers per lot, and a wide range of wafer sizes from 3 to 8 inches. Carefully selected hardware and control system features enable use on mass-production lines. The furnace interior features our proprietary metal-free construction. VF-5300H enables high-temperature processing, making it ideal for power device manufacturing. It can also perform oxynitriding.
Specifications
| Operating temperature range | 700 to 1,400°C |
|---|---|
| Supported wafer sizes | 3 to 8 inches |
| Maximum lot size | 100 wafers |
| Gases used | N2, Ar, H2, NO, N2O, NH3 |
| Options | N2 load lock, chamber cleaning mechanism |
| Applications | SiC power devices, oxynitriding, nitriding, oxidizing, mass production |
