VFS-4000 Large Bore Vertical Furnace

This large-bore vertical furnace for 4.5G/5.5G was developed by making use of semiconductor manufacturing equipment technologies for glass substrate manufacturing.
This furnace is suitable for low-compaction organic EL (OLED/AMOLED) frit sealing processes and dewatering.

Features

The semiconductor diffusion furnace has been modified to a larger scale for the flat panel display
Normal pressure processing and decompression processing are possible
Various kinds of gas atmospheres (oxidization, reduction, neutral, corrosion, etc.)
Max substrate size:1300 × 1500 mm
Large-scale LGO heater has excellent temperature characteristics

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Overview

This large-bore vertical furnace employs strict temperature characteristic control, atmosphere control and particle control, expertise for semiconductor manufacturing, for FPD. Quartz boats are used to create a low-particle, metal-free environment to enable vacuum heat treatment at 10 ppm or lower O2 concentration. This furnace is suitable for touch panel and other material contact annealing, post-baking and activation annealing.

Specifications

Outer dimension	2000(W)×2000(D)×4350(H) (furnace body)
Heater	LGO heater
Operation temperature	200~600°C
Substrate size	1300×1500
Batch size	20~25 wafers
Flat zone temperature	Less than ±3°C
Chamber material	High-grade quarts
Controller	Model VSC1000
Option	Forced-cooling system, HOST communication (SECS/GEM)
Applications	Contact Annealing, Post-bake, Activated annealing
Manufactured article	4.5·5.5 size glass plate