Solution Cases [case-006] Improving Yield for FPD Applications
- Metal contact annealing (for FPD)
- Frit firing (for FPD)
- Dehydrogenation (for FPD)
- Activation (for FPD)
- Curing (for FPD)
- VFS-4000
Achieving heat treatment at the cleanliness level of semiconductor fabrication equipment
| Support Process | Curing(for FPD), Activation(for FPD), Dehydrogenation(for FPD), Frit firing(for FPD), Metal contact annealing(for FPD) |
|---|---|
| Model Introduced | VFS-4000 Large Bore Vertical Furnace |
Problem
In the heat-treatment process for FPDs, particularly OLED and high-temperature Poly-Si liquid crystals, heat-treatment equipment at the cleanliness level of semiconductor fabrication is needed because particle generation reduces the yield.
Solution
- We developed equipment compatible with large substrates by utilizing a non-metallic chamber made of quartz and the like.
Results
- We were able to use this equipment to perform the process with very few particles, resulting in improved yield.
