Demonstration Facilities
Demonstration Equipment
We have experimentation rooms specifically for demonstrations from low to high temperatures and from batch type to continuous type. We utilize our many years of experience and results in manufacturing equipment for heat treatment production in the field of metallic materials, semiconductor production, FPD equipment, electronic component manufacturing and others in order to respond to heating requests from our customers in various fields. Please provide us with the details of your requests such as the processing method, temperature conditions and the like and we will select the equipment that suits the purpose of the processing.
Feel free to contact our sales representative.
Semiconductor manufacturing system area
Experimental laboratories with installed semiconductor manufacturing equipment are designed as Class 10 cleanrooms.
Solar cell manufacturing system area
Demonstration Equipment Example
| Field | Model | Process | Workpiece size / Furnace internal dimensions / Belt width (mm) | Temperature |
|---|---|---|---|---|
| Semiconductor | VF-1000HLP | Activated annealing, High temperature H2 annealing, Vacuum purge available | Up to φ200mm | 800 to 1800℃ |
| VF-5300H | Annealing, Oxidation (Dry, Pyrogenic) | Up to φ200mm | 700 to 1350℃ | |
| VF-5100LP | LP-CVD（Poly-Si, Si3N4, HTO） | Up to φ200mm | 600 to 850℃ | |
| VF-3000 | Annealing, Oxidation (Dry, Wet (Bubbling)), Low-temperature wet oxidation for VCSEL | Up to φ200mm | 200 to 1100℃ | |
| VF-1000 | Annealing, Oxidation (Dry, Wet (Vaporizer)), Low-temperature wet oxidation for VCSEL, Vacuum purge available | Up to φ300mm | 200 to 1100℃ | |
| VF-1000B | Low-temperature wet oxidation for VCSEL (wet (vaporizer)) | Up to φ150mm | 200 to 600℃ | |
| VF-5700B | Low temperature annealing, PIQ | Up to φ300mm | 200 to 750℃ | |
| RLA-1208-V | Annealing, Oxidation (Dry) | Up to φ200mm | 600 to 1200℃ | |
| PV (Photovoltaic) | 206A-M100 | Annealing, POCl3 | 156x156mm | 400 to 1100℃ |
| FPD | CCBS-IR | Various heat treatments for flat panel displays | 300(W)×400(L) to 3000(W)×3200(L) | RT to 250℃ |
| Electronic component | AF-INH21 | Debinding of electronic and ceramic components, metal components, and other products, Degreasing, Drying, Other heat treatment of products where it was not possible to increase heating efficiency with other conventional methods |
Furnace internal dimensions: 600(W)×600(H)×600(D) | RT+60 to 600℃ |
| AF-INH100 | Furnace internal dimensions: 1000(W)×1000(H)×1000(D) | |||
| AF-μBF | Effective dimensions:200(W)×200(H)×400(D) | 400 to 900℃ | ||
| AF-810A | Debinding of electronic and ceramic components, metal components, and other products, Degreasing, Drying, Firing Other heat treatment of products where it was not possible to increase heating efficiency with other conventional methods |
Belt width：200 | 250 to 900℃ | |
| Mesh Belt Type Continuous Furnace Multi-Inlet/Exhaust Type |
Various heat treatments for electronic components and other products | Belt width：350 | ～950℃ | |
| Mesh Belt Type Continuous Furnace Compact Conveyor Furnace 810A-II |
Various heat treatments for electronic components and other products | Belt width：200 | ～1000℃ | |
| Ceramic Conveyor Type Continuous Furnace |
Various heat treatments for electronic components and other products | Treatable workpiece sizes: Up to 200(W)×75(H) | ～1400℃ | |
| High-Temperature Inert Gas Oven INH-21CD |
Debinding of electronic and ceramic components, metal components, and other products, Degreasing, Drying, Various other heat treatments | Furnace internal dimensions: 600(W)×600(H)×600(D) | RT+60 to 600℃ | |
| High-Temperature Inert Gas Oven INH-51N2-DBS |
Furnace internal dimensions: 800(W)×800(H)×800(D) | RT+60 to 600℃ | ||
| High-Temperature Clean Oven CLH-21CD(V) |
Baking, curing, and aging for semiconductor wafers and glass substrates, Various heat treatment for electronic components and other products | Furnace internal dimensions: 700(W)×700(H)×500(D) * Opening size is 630 mm. |
RT＋70～500℃ |
Results
We have a demonstration room exclusively for client use. It helps clients make decisions about new equipment purchases. Our equipment demonstration system lets you perform advance testing, performance evaluations and other types of demonstrations. Simply request a demonstration by providing us with information about your workpiece, processing conditions and other details, and we will select the equipment matching your processing objective and arrange a schedule.
* Note that use of the demonstration room is generally only permitted for clients considering an equipment purchase. No equipment demonstrations for other purposes are permitted. Use as rental equipment is not permitted.
Number of equipment demonstrations in 2021
Semiconductor-related demonstrations: 71 (61 for Japanese manufacturers, 10 for foreign manufacturers)
Electronic component or FPD-related demonstrations: 117 (102 for Japanese manufacturers, 15 for foreign manufacturers)
