Solution Cases

This page introduces examples of solutions to customer issues utilizing the heat treatment technologies of JTEKT Thermo Systems. View a wide range of solutions including improvements that contribute to higher productivity, reduced CO2 emissions, and energy savings.

[case-025] Improving Productivity of 8-inch Wafer

Productivity of activation annealing furnace and oxynitriding furnace for SiC power semiconductor has been improved to process 8-inch wafer at 100 wafers per batch.

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- Nitride, Oxynitride
- Activation
- VF-5300HLP
- VF-5300H
[case-024] Wafer Handling Robot Comptible with Difference in Wafer Pitches Between Devices

Treatment with 6 inch SMIF pod without compromising productivity is available by using wafer handling robot that can transfer wafer between devices with different pitches.

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- Impurity diffusion
- Thermal oxideation
- Annealing
- VF-5100
- VF-5300(B)
[case-023]Vacuum Load-lock Transfer Unit for Ramp Annealing Systems

Transfer system with vacuum load-lock improves product characteristics and throughput.

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- Contact annealing
- RLA-4100V
[case-022] Continuous Furnace with Superheated Steam

Enabling heat treatment with a continuous furnace in a superheated steam atmosphere

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- Continuous Furnace
- AllFit® Series
[case-021] Recovering Waste Heat to Reduce Environmental Impact

Reducing energy consumption with a heat exchange system that utilizes waste heat

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- CCBS series
[case-020] Powder Treatment Tube Furnace

Development of tube furnaces capable of uniform heat treatment of powders

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[case-019]Reduction of wafer transfer errors

Wafer transfer error is reduced by enabling the choice of timing of wafer suction

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[case-018]Improving the accuracy of detecting lamp disconnection

Improving the accuracy of detecting lamp disconnection by modification of software

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- Annealing
[case-017] Clean Oven System for Both Fan-Out Wafers and Si Wafers

Enable one clean oven system to be used for treatments of both Fan-Out wafers and Si wafers

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- Polymide curing
- SO2-12-F
[case-016] Low cost large bore vertical furnace

Cost reduction of large bore vertical furnace by optimizing required functions

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- Curing (for FPD)
- VFS-4000
[case-015] Large Batch Type Clean Oven System

Double the number of batches to improve productivity

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- Other
- SO2-12-F
[case-014] Handling of easily damaged thin wafers

Solves transport problems caused by cracking and chipping of thin wafers

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- Annealing
- VF-5100
[case-013] Rapid cooling horizontal furnace

Rapid cooling is possible by automatically moving the heater.

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- Annealing
- Model 200 Series
[case-012] High Performance Polyimide Curing System for FPD

Reduction of organic by-product sediments in polyimide curing of large flat panel substrates

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- Curing (for FPD)
- VFS-4000
[case-011] CNT(Carbon nanotube) Growth System

CNT(Carbon nanotube) growth system for large diameter wafers

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- Nitride, Oxynitride
- VF-1000(H)
[case-010] Improved Experimental and Development Accuracy

Improving experimental and development accuracy with a high-performance small-scale vertical furnace for experiments

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- Annealing
- VF-1000(H)
[case-009] Energy Saving of Vertical Furnace for Low Temperature Range

Improvement of vertical furnace to energy saving by optimizing thermal insulation design

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- Polymide curing
- VF-3000(B)
[case-008] Improving Productivity (reconfiguration of the treatment process)

Significantly improving productivity with a high-performance vertical furnace

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- Annealing
- VF-3000(B)
[case-007] Increasing Yield by Reducing Contaminants Within the Furnace

Reducing sediment with an automatic cleaning mechanism inside the furnace

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- Polymide curing
- Resist curing
- VF-5300(B)
[case-006] Improving Yield for FPD Applications

Achieving heat treatment at the cleanliness level of semiconductor fabrication equipment

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- Metal contact annealing (for FPD)
- Frit firing (for FPD)
- Dehydrogenation (for FPD)
- Activation (for FPD)
- Curing (for FPD)
- VFS-4000