Solution Cases
This page introduces examples of solutions to customer issues utilizing the heat treatment technologies of JTEKT Thermo Systems. View a wide range of solutions including improvements that contribute to higher productivity, reduced CO2 emissions, and energy savings.
- All Cases
- Semiconductor
- FPD and Film Manufacturing
- Electronic Component Manufacturing
- Prototyping Experiments
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[case-025] Improving Productivity of 8-inch Wafer
Productivity of activation annealing furnace and oxynitriding furnace for SiC power semiconductor has been improved to process 8-inch wafer at 100 wafers per batch.
- Nitride, Oxynitride
- Activation
- VF-5300HLP
- VF-5300H
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[case-024] Wafer Handling Robot Comptible with Difference in Wafer Pitches Between Devices
Treatment with 6 inch SMIF pod without compromising productivity is available by using wafer handling robot that can transfer wafer between devices with different pitches.
- Impurity diffusion
- Thermal oxideation
- Annealing
- VF-5100
- VF-5300(B)
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[case-023]Vacuum Load-lock Transfer Unit for Ramp Annealing Systems
Transfer system with vacuum load-lock improves product characteristics and throughput.
- Contact annealing
- RLA-4100V
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[case-022] Continuous Furnace with Superheated Steam
Enabling heat treatment with a continuous furnace in a superheated steam atmosphere
- Continuous Furnace
- AllFit® Series
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[case-021] Recovering Waste Heat to Reduce Environmental Impact
Reducing energy consumption with a heat exchange system that utilizes waste heat
- CCBS series
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[case-020] Powder Treatment Tube Furnace
Development of tube furnaces capable of uniform heat treatment of powders
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[case-019]Reduction of wafer transfer errors
Wafer transfer error is reduced by enabling the choice of timing of wafer suction
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[case-018]Improving the accuracy of detecting lamp disconnection
Improving the accuracy of detecting lamp disconnection by modification of software
- Annealing
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[case-017] Clean Oven System for Both Fan-Out Wafers and Si Wafers
Enable one clean oven system to be used for treatments of both Fan-Out wafers and Si wafers
- Polymide curing
- SO2-12-F
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[case-016] Low cost large bore vertical furnace
Cost reduction of large bore vertical furnace by optimizing required functions
- Curing (for FPD)
- VFS-4000
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[case-015] Large Batch Type Clean Oven System
Double the number of batches to improve productivity
- Other
- SO2-12-F
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[case-014] Handling of easily damaged thin wafers
Solves transport problems caused by cracking and chipping of thin wafers
- Annealing
- VF-5100
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[case-013] Rapid cooling horizontal furnace
Rapid cooling is possible by automatically moving the heater.
- Annealing
- Model 200 Series
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[case-012] High Performance Polyimide Curing System for FPD
Reduction of organic by-product sediments in polyimide curing of large flat panel substrates
- Curing (for FPD)
- VFS-4000
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[case-011] CNT(Carbon nanotube) Growth System
CNT(Carbon nanotube) growth system for large diameter wafers
- Nitride, Oxynitride
- VF-1000(H)
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[case-010] Improved Experimental and Development Accuracy
Improving experimental and development accuracy with a high-performance small-scale vertical furnace for experiments
- Annealing
- VF-1000(H)
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[case-009] Energy Saving of Vertical Furnace for Low Temperature Range
Improvement of vertical furnace to energy saving by optimizing thermal insulation design
- Polymide curing
- VF-3000(B)
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[case-008] Improving Productivity (reconfiguration of the treatment process)
Significantly improving productivity with a high-performance vertical furnace
- Annealing
- VF-3000(B)
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[case-007] Increasing Yield by Reducing Contaminants Within the Furnace
Reducing sediment with an automatic cleaning mechanism inside the furnace
- Polymide curing
- Resist curing
- VF-5300(B)
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[case-006] Improving Yield for FPD Applications
Achieving heat treatment at the cleanliness level of semiconductor fabrication equipment
- Metal contact annealing (for FPD)
- Frit firing (for FPD)
- Dehydrogenation (for FPD)
- Activation (for FPD)
- Curing (for FPD)
- VFS-4000