Solution Cases [case-014] Handling of easily damaged thin wafers
- Annealing
- VF-5100
Solves transport problems caused by cracking and chipping of thin wafers
| Support Process | Annealing |
|---|---|
| Model Introduced | Model VF-5100 |
Problem
Thin wafers are subject to large irregular deformations such as wafer warping and bending. Therefore, when a wafer is transferred between a wafer cassette and a quartz boat for processing by a robot, a wafer exceeding an allowable transfer amount may be damaged due to contact or the like, and stable processing may not be performed.
Solution
Changed to a specification that does not transport wafers in the heat treatment equipment. It changed the wafer cassette to quartz and made it possible to transport thin wafer quartz cassettes.
Results
By transporting a thin wafer by a cassette without directly touching the wafer, stable transport is possible without being affected by deformation such as warping or bending of the wafer.