VF-5300HLP Activation Annealing Furnace
A vertical furnace enabling ultra high-temperature processing, ideal for power device manufacturing. Supports 6- to 8-inch wafers and has an automatic wafer transfer mechanism. Can be used for mass production.
Features
- Supports Max.100 wafers per lot, and use on mass-production lines.
- Supports a wide range of wafer sizes from 6 to 8 inches.
- The furnace interior features our proprietary metal-free construction.
- Enables temperature monitoring in wafer vicinity.
- An N2 load lock is provided as a standard feature.
- High-throughput cassette-to-cassette transport
- H2 atmosphere annealing with trench rounding is available as an option.
Overview
VF-5300HLP is a vertical furnace that can process a maximum of 100 wafers per lot, and a wide range of wafer sizes from 6 to 8 inches. Carefully selected hardware and control system features enable use on mass-production lines. The furnace interior features our proprietary metal-free construction. VF-5300HLP supports ultra high-temperature activation annealing processes.
Specifications
| Operating temperature range | 700 to 1,900°C (700 to 1,800°C for H2 annealing) |
|---|---|
| Supported wafer sizes | 6 to 8 inches |
| Maximum lot size | 100 wafers |
| Gases used | N2, Ar, H2 (option) |
| Applications | SiC power devices, mass production, activation annealing |
