Solution Cases [case-005] Warp Reduction Annealing

  • Other
  • SO2-12-F

Achieving an optimal warp reduction annealing process by employing expertise and analytic technology

Support Process Other
Model Introduced SO2-12-F


In FO-WLP, FO-PLP and the like, substrate warping occurs due to stress. Although an annealing process is necessary to reduce warping, optimal substrate holding equipment is required.


  • We undertook an analysis and submitted a proposal with a simulation of interference during transfer, effects of heat capacity, and optimal substrate holding equipment capable of mitigating warpage.


  • Stable processing and transfer was achieved even for wafers exhibiting severe warping.