Solution Cases [case-005] Warp Reduction Annealing
- Other
- SO2-12-F
Achieving an optimal warp reduction annealing process by employing expertise and analytic technology
| Support Process | Other |
|---|---|
| Model Introduced | SO2-12-F |
Problem
In FO-WLP, FO-PLP and the like, substrate warping occurs due to stress. Although an annealing process is necessary to reduce warping, optimal substrate holding equipment is required.
Solution
- We undertook an analysis and submitted a proposal with a simulation of interference during transfer, effects of heat capacity, and optimal substrate holding equipment capable of mitigating warpage.
Results
- Stable processing and transfer was achieved even for wafers exhibiting severe warping.
