Heated-air Circulating Type Clean Oven
Overview
This clean oven for semiconductor production was developed by introducing the best-selling FPD manufacturing equipment, single wafer processing clean oven. For advanced semiconductor packaging such as chiplet and 2.xD/3D, this oven can be used for heat treatment of Si interposer, RDL (Redistribution Layer) of organic and glass interposer, etc., supporting various substrates up to 600×600mm in size, including Φ300mm. This oven is also available for drying of printed circuit board, reflow after solder bumping, and baking after chip molding. Especially in low-temperature processing such as polyimide curing, high throughput in a short cycle time is realized.
Specifications
Model | SO2-12-F | SO2-12L-F | SO2-30L-F | SO2-60-F |
---|---|---|---|---|
Heating method | Heated-air circulating | |||
Heater | Sheathed heater | |||
Operation temperature | 70 to 450℃ | 70 to 400℃ | 70 to 400℃ | 70 to 300℃ |
Wafer size (mm) | Φ300 | Φ300 | 300 × 300 | 510 × 515 600 × 600 |
Batch size* | 50 wafers | 52 wafers | 26 wafers | 24 wafers |
I/O port | 4 | |||
Finger | 2 wafers | |||
HOST communication | HSMS/GEM300 (Option) |
* It may vary depending on wafer thickness and warpage.
Applications
Customize
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[case-015] Large Batch Type Clean Oven System
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