High-Temperature Clean Oven
Features
- The chamber interior can maintain class 100 cleanliness when the temperature is stable.
- There are 2 hot-air blower types: front side blower with horizontal circulation (type V) and side blower (type III). Both achieve high thermal efficiency and good temperature uniformity.
- Inert gases can be introduced into the chambers to use the ovens as inert gas ovens.
Overview
2 types of hot-air blowers are available, side blower type (type III) and front side blower type (type V). The clean ovens are equipped with heat-resistant high-performance filters and our unique cooling units that enable high-temperature processing at up to 530°C (or up to 500°C with type V). Thanks to the excellent temperature uniformity achieved by the hot-air circulation system and class 100 air cleanliness (when the temperature is stable), the clean ovens are optimal for heating of optical disc, LCD substrates, wafers such as FO-WLP and WL-CSP, and square substrates for advanced semiconductor packaging such as chiplet and 2.xD/3D requiring processing in a clean environment. N2 gas can also be introduced into the chamber to use the oven at 20 ppm or lower residual O2 concentrations.
Specifications
| Outer dimension | CLH-21CD(H) W1285 × D1605 × H2020 mm CLH-35CD(H) W1285 × D1775 × H2090 mm |
|---|---|
| Inner dimension | CLH-21CD(H) W670 × D500 × H700 mm CLH-35CD(H) W670 × D670 × H790 mm |
| Heating method | Heated-air circulating |
| Operation temperature | RT+70 to 450°C (Std.-type) RT+70 to 530°C (H-type) |
| Wafer size | φ100 to 300mm Other (Rectangular substrate etc) |
| Batch size | 25 to 200 wafers (1 to 8 cassettes) |
| Standard accessory | Shelf plates (2 plates) Loading capacity 15kg/plate |
| Options | Oxygen analyzer, oxygen concentration meter, signal tower, cold trap, emergency stop, water leak detector |
| Applications | Baking and curing for semiconductor wafers and glass substrates |
