Solution Cases

This page introduces examples of solutions to customer issues utilizing the heat treatment technologies of JTEKT Thermo Systems. View a wide range of solutions including improvements that contribute to higher productivity, reduced CO2 emissions, and energy savings.

[case-031]Energy saving of Mesh Belt Type Continuous Furnace

Efforts to reduce energy consumption of the mesh belt furnaces used for heat treatment of electronic components and other products.

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- Binder degreasing (debinding)
- Firing
- Electrode Drying
- Other
- Continuous Furnace
[case-030]Vacuum purge type box furnace that has expanded its application range by doubling its effective heating volume

Effective heating volume of our vacuum purge type small box furnace for research and development has been doubled, making it usable for a variety of experiments.

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- Binder degreasing (debinding)
- Firing
- Other
- μBF
[case-029] Improving the Transfer Stability of Fan-Out wafer

In the FOWLP (Fan-Out Wafer Level Package) heat treatment process, the stability of wafer transfer has been improved by developing a dedicated boat and optimizing the shape of the robot hand.

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- Packaging (Polyimide cure)
- VF-5700B
- SO2-12-F
[case-028]Improving the Productivity of Contact Annealing Equipment for SiC Power Semiconductors by adding Process Chamber and Reviewing the Transfer Mechanim

Productivity of our contact annealing equipment for SiC power semiconductor has been improved by increasing the number of process chambers and reviewing its transfer mechanism (2 to 2.4 times higer productivity than conventional equipment).

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- Contact annealing
- RLA-4200V
[case-027]Improving the Productivity of Contact Annealing Equipment for SiC Power Semiconductors

Productivity of our contact annealing equipment for SiC power semiconductors has been improved by reviewing and redesigning its transfer function.

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- Contact annealing
- RLA-4100V
[case-026] Visualization of Degreasing State by Measuring Exhaust Gas Concentration

Binder decomposition behavior in the degreasing (debinding) treatment of ceramics can be visualized by measuring and analyzing exhaust gas concentration.

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- Binder degreasing (debinding)
- Oven series
- AllFit Series
[case-025] Improving Productivity of 8-inch Wafer

Productivity of activation annealing furnace and oxynitriding furnace for SiC power semiconductor has been improved to process 8-inch wafer at 100 wafers per batch.

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- Nitride, Oxynitride
- Activation
- VF-5300HLP
- VF-5300H
[case-024] Wafer Handling Robot Comptible with Difference in Wafer Pitches Between Devices

Treatment with 6 inch SMIF pod without compromising productivity is available by using wafer handling robot that can transfer wafer between devices with different pitches.

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- Impurity diffusion
- Thermal oxideation
- Annealing
- VF-5100
- VF-5300(B)
[case-023]Vacuum Load-lock Transfer Unit for Ramp Annealing Systems

Transfer system with vacuum load-lock improves product characteristics and throughput.

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- Contact annealing
- RLA-4100V
[case-022] Continuous Furnace with Superheated Steam

Enabling heat treatment with a continuous furnace in a superheated steam atmosphere

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- Continuous Furnace
- AllFit Series
[case-021] Recovering Waste Heat to Reduce Environmental Impact

Reducing energy consumption with a heat exchange system that utilizes waste heat

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- CCBS
[case-020] Powder Treatment Tube Furnace

Development of tube furnaces capable of uniform heat treatment of powders

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[case-019]Reduction of wafer transfer errors

Wafer transfer error is reduced by enabling the choice of timing of wafer suction

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[case-018]Improving the accuracy of detecting lamp disconnection

Improving the accuracy of detecting lamp disconnection by modification of software

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- Annealing
[case-017] Clean Oven System for Both Fan-Out Wafers and Si Wafers

Enable one clean oven system to be used for treatments of both Fan-Out wafers and Si wafers

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- Polymide curing
- SO2-12-F
[case-016] Low cost large bore vertical furnace

Cost reduction of large bore vertical furnace by optimizing required functions

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- Curing (for FPD)
- VFS-4000
[case-015] Large Batch Type Clean Oven System

Double the number of batches to improve productivity

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- Other
- SO2-12-F
[case-014] Handling of easily damaged thin wafers

Solves transport problems caused by cracking and chipping of thin wafers

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- Annealing
- VF-5100
[case-013] Rapid cooling horizontal furnace

Rapid cooling is possible by automatically moving the heater.

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- Annealing
- Model 200 Series
[case-012] High Performance Polyimide Curing System for FPD

Reduction of organic by-product sediments in polyimide curing of large flat panel substrates

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- Curing (for FPD)
- VFS-4000