This clean oven for mass production can be used for various heat treatment in packaging processes, equipped with automatic substrate transfer mechanism supports various square substrates (up to 600x600mm) for chiplet and 2.xD/3D advanced semiconductor packaging, in addition to Φ300mm wafers in which we have extensive experience in polyimide cure processing of FO-WLP and WL-CSP.
Low temperature processing such as polyimide curing is also available.
This is a large-bore vertical furnace for heat treatment of RDL (Redistribution Layer) and glass interposers for advanced semiconductor packaging, as well as LCD, OLED (organic EL) and polyimide film.
