This low-priced vertical furnace equipped with an auto conveyor can be used for a range of functions from R&D to mass production of 4- to 8-inch wafers.
Ultra-high-temperature treatment is available and best suited for power device manufacturing.
This small production type vertical furnace for experiments and research (R&D) achieves high-quality processing.
This furnace is compact and requires only a small installation area but is usable for a wide range of wafer diameters and exhibits the same temperature characteristics as those of mass-production furnaces.
These clean ovens for mass production can be used for various heat treatments in packaging processes, equipped with automatic substrate transfer mechanism supports various square substrates (up to 600x600mm) for advanced semiconductor packaging, in addition to Φ300mm wafers in which we have extensive experience in polyimide cure processing of FO-WLP and WL-CSP.
Low temperature processing such as polyimide curing is also available.
This is a large-bore vertical furnace for heat treatment of RDL (Redistribution Layer) and glass interposers for advanced semiconductor packaging, as well as LCD, OLED (organic EL) and polyimide film.
A vertical furnace enabling ultra high-temperature processing, ideal for power device manufacturing. Supports 3- to 8-inch wafers and has an automatic wafer transfer mechanism.
A vertical furnace enabling high-temperature processing, ideal for power device manufacturing. Features an automatic wafer transfer mechanism, and can be used for mass production.
A vertical furnace enabling high-temperature processing, ideal for power device manufacturing. Features an automatic wafer transfer mechanism, and can be used for applications ranging from R&D to mass production.
