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This vertical furnace with a built-in stocker processes 8-inch wafers at ultra-high temperatures in large batches.
This furnace is a semiconductor heat treatment system that can perform oxidation, diffusion, LPCVD, activation annealing and various other heat treatments.

This large-batch, diffusion, LPCVD, vertical furnace performs 4- to 8-inch wafer ultra-high-temperature treatment.
The system can be flexibly configured to enable your production line to process a variety of products. This furnace excels at power device manufacturing.

This low-priced vertical furnace equipped with an auto conveyor can be used for a range of functions from R&D to mass production of 4- to 8-inch wafers.
We have achieved such a low price that back end users can introduce this furnace.
Ultra-high-temperature treatment is available and best suited for power device manufacturing.

This small production type vertical furnace for experiments and research (R&D) achieves high-quality processing.
This furnace is compact and requires only a small installation area but is usable for a wide range of wafer diameters and exhibits the same temperature characteristics as those of mass-production furnaces.

This system for 4- to 8-inch wafers performs activation and oxidation in a vacuum (LP) environment and N2 load-lock atmosphere. The upper and lower cross lamps (halogen) and a soaking system are used for higher in-plane temperature distribution uniformity.This lamp annealing system for 4-inch to 8-inch wafers achieves high-quality processing even for use in R&D. Activation and oxidation are available in a vacuum (LP) environment and N2 load-lock atmosphere.

A vertical furnace enabling ultra high-temperature processing, ideal for power device manufacturing. Supports 6- to 8-inch wafers and has an automatic wafer transfer mechanism. Can be used for mass production.

A vertical furnace enabling high-temperature processing, ideal for power device manufacturing. Supports oxynitriding and wafers of up to 8 inches in size. Features an automatic wafer transfer mechanism, and can be used for mass production.

Vacuum load-lock capability improves throughput.
Supports various wafers including Si, GaN, and SiC.

A vertical furnace enabling ultra high-temperature processing, ideal for power device manufacturing. Supports 3- to 8-inch wafers and has an automatic wafer transfer mechanism. Can be used for applications ranging from R&D to mass production.